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Sectioning Consumables

Precision Wafering Blade

 

Metal Bond (MB) – Is a hard bond, which is required when cutting aggressive materials such as ceramics, refractories, glass, and rock. Metal Bond has a depth of abrasive generally 1/8”. A low concentration is favored to allow the blade to cut more freely. High concentrations are required when cutting aggressive materials such as ceramics.

Resin Bond (RB) – Is a softer, more forgiving bond matrix. Resin Bond is effective when cutting harder, denser materials like carbide. A better finish can be achieved than with the electroplated or metal bond wheels. Generally, all cutting and slicing operations use high concentration.

 
Diamond Wafering Blades – Metal Bond High Concentration
       Recommended for general metallographic sectioning, excluding ferrous alloys, at either low (<1,000 RPM) or high (>1,000 RPM) speeds.

Diameter Arbor Thickness Abrasive Type Pack Order Code.
75 12.7 0.4 Metal Bond 1 01-081075
100 12.7 0.4 Metal Bond 1 01-081100
125 12.7 0.4 Metal Bond 1 01-081125
150 12.7 0.5 Metal Bond 1 01-081150
180 12.7 0.8 Metal Bond 1 01-081180
200 12.7 0.8 Metal Bond 1 01-081200
200 32 1.2 Metal Bond 1 01-082200
250 32 1.3 Metal Bond 1 01-081250
300 32 1.6 Metal Bond 1 01-081300
350 32 1.8 Metal Bond 1 01-081355

 
Diamond Wafering Blades – Metal Bond Low Concentration

      Recommended for cutting very hard or brittle materials such as ceramics, silicon, glass and refractories where chipping and pullout need to be minimized. Most commonly used at lower (<1,000 RPM) speeds.
 
Diameter Arbor Thickness Abrasive Type Pack Order Code.
75 12.7 0.2 Metal Bond 1 01-091076
100 12.7 0.3 Metal Bond 1 01-091100
125 12.7 0.4 Metal Bond 1 01-091125
150 12.7 0.5 Metal Bond 1 01-091150
175 12.7 0.7 Metal Bond 1 01-091175
200 12.7 0.8 Metal Bond 1 01-091200
200 32 1.2 Metal Bond 1 01-092200
250 32 1.3 Metal Bond 1 01-091250
300 32 1.6 Metal Bond 1 01-091300
350 32 1.8 Metal Bond 1 01-091355


Diamond Wafering Blades – Resin Bond

      Recommended for cutting hard, brittle or delicate materials including ceramics, carbides, composites and exotic metals where low heat generation or improved surface finishes are  desired.
      Most commonly used at higher (>1,000 RPM) speeds.


Diameter Arbor Thickness Abrasive Type Pack Order Code.
100 12.7 0.5 Resin Bond 1 01-101100
125 12.7 0.5 Resin Bond 1 01-101125
150 12.7 0.5 Resin Bond 1 01-101150
175 12.7 0.7 Resin Bond 1 01-101175
200 12.7 0.8 Resin Bond 1 01-101200
200 32 1.2 Resin Bond 1 01-102200
250 32 1.3 Resin Bond 1 01-101250
300 32 1.6 Resin Bond 1 01-101300
350 32 1.8 Resin Bond 1 01-101355
 
 

CBN Wafering Blades - Metal Bond
       Recommended for sectioning hard steel, and iron, cobalt, nickel and lead based alloys. Most commonly used at lower (<1,000 RPM) speeds.
 
 
Diameter Arbor Thickness Abrasive Type Pack Order Code.
75 12.7 0.2 Metal Bond 1 01-111075
100 12.7 0.4 Metal Bond 1 01-111100
125 12.7 0.5 Metal Bond 1 01-111125
150 12.7 0.5 Metal Bond 1 01-111150
175 12.7 0.7 Metal Bond 1 01-111175
200 12.7 0.8 Metal Bond 1 01-111200
200 32 1.2 Metal Bond 1 01-112200
250 32 1.3 Metal Bond 1 01-111250
300 32 1.6 Metal Bond 1 01-111300
350 32 1.8 Metal Bond 1 01-111355

CBN Wafering Blades - Resin Bond

       Recommended for sectioning hard steel above HRC 60. Most commonly used at higher (>1,000 RPM) speeds.

Diameter Arbor Thickness Abrasive Type Pack Order Code.
75 12.7 0.2 Metal Bond 1 01-111075
100 12.7 0.4 Metal Bond 1 01-111100
125 12.7 0.5 Metal Bond 1 01-111125
150 12.7 0.5 Metal Bond 1 01-111150
175 12.7 0.7 Metal Bond 1 01-111175
200 12.7 0.8 Metal Bond 1 01-111200
200 32 1.2 Metal Bond 1 01-112200
250 32 1.3 Metal Bond 1 01-111250
300 32 1.6 Metal Bond 1 01-111300
350 32 1.8 Metal Bond 1 01-111355

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