Used for final polishing, mixtures of abrasive particles dispersed throughout a chemically aggressive liquid carrier. It provides a chemical-mechanical polishing action, resulting in deformation-free surfaces.



CMP-300 Silica Suspension
       This non-crystallizing silica suspension with 9.8 pH produces an excellent final polish for a wide variety of materials, especially nonferrous metals, PCBs and ICs.

 
 
CMP-400 Silica Suspension
       This non-crystallizing silica suspension with 10.2 pH produces an excellent final polish.
       Especially for Titanium, iron, steel.