Microelectronic components contain various materials, such as glass, ceramics, metals, and polymers with widely differing properties. Sample preparation therefore requires controlled material removal to reveal the individual characteristics of these materials.

We have developed equipment, consumables that used for failure analysis of chip-based components: Cross sections of components are studied to identify potential microvias, cracks, voids, solder balls, conducting layers or connections.

Maimet actively cooperates with universities and research institutions to provide experimental researchers and university professors and students with a wide range of knowledge and depth.

Our experience and expertise enable us to communicate and cooperate with many of the world's leading materials laboratories to provide technical support for specimen preparation in new areas.